系统工程与电子技术 ›› 2024, Vol. 46 ›› Issue (3): 868-881.doi: 10.12305/j.issn.1001-506X.2024.03.12

• 传感器与信号处理 • 上一篇    下一篇

一种侦干探多功能一体化微系统设计

肖国尧1,*, 廖桂生2, 柯华锋1, 李帅3, 全英汇1   

  1. 1. 西安电子科技大学电子工程学院, 陕西 西安 710071
    2. 西安电子科技大学雷达信号处理全国 重点实验室, 陕西 西安 710071
    3. 中国空间技术研究院通信与导航卫星总体部, 北京 100094
  • 收稿日期:2022-07-01 出版日期:2024-02-29 发布日期:2024-03-08
  • 通讯作者: 肖国尧
  • 作者简介:肖国尧(1986—), 男, 副研究员, 博士研究生, 主要研究方向为多功能一体化微系统技术、实时信号处理技术
    廖桂生(1963—), 男, 教授, 博士, 主要研究方向为阵列信号处理、自适应信号处理、信号检测与估计
    柯华锋(1995—), 男, 硕士研究生, 主要研究方向为多功能一体化微系统集成
    李帅(1991—), 男, 工程师, 博士, 主要研究方向为非合作信号无源定位、阵列信号处理、自适应信号处理
    全英汇(1981—), 男, 教授, 博士, 主要研究方向智能感知、多功能综合电子微系统、敏捷雷达、雷达遥感

Design of a multi-functional integrated microsystem for reconnaissance jamming and detection

Guoyao XIAO1,*, Guisheng LIAO2, Huafeng KE1, Shuai LI3, Yinghui QUAN1   

  1. 1. School of Electronic Engineering, Xidian University, Xi'an 710071, China
    2. National Key Laboratory of Radar Signal Processing, Xidian University, Xi'an 710071, China
    3. Institude of Telecommunication and Navigation Satellites, China Academy of Space Technology, Beijing 100094, China
  • Received:2022-07-01 Online:2024-02-29 Published:2024-03-08
  • Contact: Guoyao XIAO

摘要:

在无人机载、弹载综合电子应用领域, 基于传统分立器件设计的信号处理系统面临日益突显的资源受限问题。因此, 针对无人机载、弹载综合电子系统的多功能、小型化、高性能应用的迫切需求, 提出一种侦干探多功能一体化信号处理微系统集成设计技术。基于三维堆叠等先进封装技术, 将射频直采数模/模数转换器、可编程逻辑器件、处理器、大容量易失型存储器、非易失性存储器以及阻容等诸多元件进行共封装设计集成, 构成可同时完成侦察、干扰、探测功能信号处理的微系统, 并构建多功能应用场景, 完成软硬件测试验证。该微系统不仅在体积、重量、性能、集成度等方面具有一定优越性, 而且大大简化了信号处理系统的复杂电路设计, 更便于系统的标准化、通用化和软件化, 具有较大的应用前景。

关键词: 多功能, 微系统, 异质异构, 三维堆叠, 侦干探一体化

Abstract:

In the field of unmanned aerial vehicle and missile-borne integrated electronic applications, the signal processing system based on traditional discrete device design is faced with increasingly prominent problem of resource constraints. Therefore, an integrated signal processing microsystem integration design technology for multifunctional integration of reconnaissance jamming and detection is proposed, aiming at the urgent needs of multi-function, miniaturization and high-performance applications of unmanned aerial vehicle and missile-borne integrated electronic system. Based on three-dimensional stacking and other advanced packaging technology, the radio frequency direct acquisition digital-to-analog converter/analog-to-digital converter (DAC/ADC), field programmable gate array (FPGA), advanced RISC machine (ARM), double-data-rate fourth generation synchronous dynamic random access memory (DDR4 SDRAM), multiple chip package (MCP) and resistance and capacitance components are co-packaged and integrated to form a microsystem that can simultaneously complete signal processing of reconnaissance, jamming and detection functions, and construct multi-functional application scenarios and complete software and hardware testing and verification. The microsystem has some advantages in volume, weight, performance and integration. Moreover, it greatly simplifies the complex circuit design of signal processing system, and is more convenient for standardization, generalization and softwareization of the system, so it has a great application prospect.

Key words: multi-functional, microsystem, heterogeneous isomerism, three-dimensional stacking, integration of reconnaissance jamming and detection

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